Laser Micromachining Application Area

Wafer (Dicing, Drilling), Polymer (Cutting, Drilling),
Glass (Patterning, Cutting), Flexible PCB (Cutting, Drilling),
Solar Wafer Scribing, Antenna Patterning,
Micro-welding

Laser Machine for Micro/Nano Processing

激光系统规格，性能

激光发电器
激光 Source	Nd:YAG (Coherent)
激光甭普	Diode Pump
激光束波长 (nm)	355 (UV)
激光动力	7W@60kHz
光学界
Writing speed (cps)	140 ~ 220
Focus size (um)	10
Scan field (mm)	Maz. 140 x 140
Stage
Working area (mm)	450 x 450 x 450
位置精密度 (um)	±20
其它附加装备
真空吸入	Vacuum Suction
关联软件
CAD 资料	dxf
加工资料	sjf, txt
性能
截断速度 (mm/s)	30