Laser Micromachining Application Area

Wafer (Dicing, Drilling), Polymer (Cutting, Drilling),
Glass (Patterning, Cutting), Flexible PCB (Cutting, Drilling),
Solar Wafer Scribing, Antenna Patterning,
Micro-welding

Laser Machine for Micro/Nano Processing

Laser System’s Specifications and Performance

Laser Oscillators
Laser Source	Nd:YAG (Coherent)
Laser Pumping	Diode Pump
Beam Wavelength (nm)	355 (UV)
Laser Power	7W@60kHz
Optical System
Writing speed (cps)	140 ~ 220
Focus size (um)	10
Scan field (mm)	Maz. 140 x 140
Stage
Working area (mm)	450 x 450 x 450
Location Precision (um)	±20
Additional Equipments
Vacuum	Vacuum Suction
Related Programs
CAD Data	dxf
Processing Data	sjf, txt
Performance
Cutting Speed (mm/s)	30